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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B <t>)</t> <t>High-speed</t> camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].
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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B <t>)</t> <t>High-speed</t> camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].
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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B <t>)</t> <t>High-speed</t> camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].
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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B <t>)</t> <t>High-speed</t> camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].
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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B <t>)</t> <t>High-speed</t> camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].
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( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B ) High-speed camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].

Journal: Science Advances

Article Title: Abrupt eruptive instability of ice adhered to solid surfaces

doi: 10.1126/sciadv.adz8663

Figure Lengend Snippet: ( A ) Schematic of illustrating the cooling-induced ice eruptive fracture on solid substrate. ( B ) High-speed camera snapshots of the ice ejection on hydrophilic silicon wafer substrate when cooled to −122°C. ( C ) High-speed camera snapshots of the eruptive fracture of the ice and the substrate disintegration at −133°C. ( D ) The ice bound to the light-weight substrate leapt. ( E ) Evolution of calculated mechanical energy with fracture temperature for varying formation temperature of ice. Inset images display bound leap and motionless fractures at different temperatures, corresponding to ice with different formation temperature, respectively. The critical temperature T c = −93° ± 3°C is highlighted. Time τ = 0 ms in (B) to (D) denotes the onset of crack formation. The cooling rate is set as −0.5°C s −1 . Freezing water volume: 20 μl. Scale bars, 5 mm [(B) to (E)].

Article Snippet: The fracture dynamics of the ice plate was observed with a polarized microscope (LVDIA-N, Nikon) in conjunction with a high-speed camera (Phantom v7.3) and a digital camera (DS-Ri2, Nikon).

Techniques:

( A ) Material distribution according to their TECs and Young’s modulus values . Adapted with permission from , copyright 2011, Elsevier. The color dots show the occurrence of ice eruptive fracture on the corresponding materials. Insets: High-speed camera snapshots of bound leap of ice with aluminum alloy, sapphire, and quartz substrate. ( B ) Design of the automatic detachment of ice using substrate deformation upon temperature variation. ( C ) Spontaneous detachment of an ice block (volume: 100 ml) from a bimetallic strip upon cooling to −53°C. Scale bars, 1 cm (A) and 5 cm (C).

Journal: Science Advances

Article Title: Abrupt eruptive instability of ice adhered to solid surfaces

doi: 10.1126/sciadv.adz8663

Figure Lengend Snippet: ( A ) Material distribution according to their TECs and Young’s modulus values . Adapted with permission from , copyright 2011, Elsevier. The color dots show the occurrence of ice eruptive fracture on the corresponding materials. Insets: High-speed camera snapshots of bound leap of ice with aluminum alloy, sapphire, and quartz substrate. ( B ) Design of the automatic detachment of ice using substrate deformation upon temperature variation. ( C ) Spontaneous detachment of an ice block (volume: 100 ml) from a bimetallic strip upon cooling to −53°C. Scale bars, 1 cm (A) and 5 cm (C).

Article Snippet: The fracture dynamics of the ice plate was observed with a polarized microscope (LVDIA-N, Nikon) in conjunction with a high-speed camera (Phantom v7.3) and a digital camera (DS-Ri2, Nikon).

Techniques: Blocking Assay, Stripping Membranes